SiC Wafer Laser Cutting Equipment - Global and China Top Players Market Share and Ranking 2023
According to the research report, the global market for SiC Wafer Laser Cutting Equipment should grow from US$ 91 million in 2022 to US$ 298.4 million by 2029, with a CAGR of 16.3% for the period of 2023-2029.
Global key players of SiC wafer laser cutting equipment include DISCO Corporation, SuZhou Delphi Laser and Han's Laser, etc. The top three players hold a share over 60%.From the perspective of consumption value by region，Asia-Pacific (excluding China) is the largest market of SiC wafer laser cutting equipment, followed by China, North America, and Europe. In terms of type, processing sizes up to 6 Inches account for more than 75% of the market share. In terms of application, foundry has a share over 60 %.
Silicon carbide (SiC) was discovered in 1893 as an industrial abrasive for grinding wheels and automotive brakes. The scheme of laser cutting silicon carbide is laser modified cutting technology. The principle is to use a laser beam with a high transmission wavelength to focus on the inside of the wafer through a lens, and multiphoton absorption occurs, resulting in a local deformation layer, namely modified layer. The layer is mainly composed of holes, high dislocation density layers and cracks. The modified layer is the starting point of subsequent wafer dicing and cracking. The modified layer can be confined inside the wafer by optimizing the laser and optical path system, and no thermal damage is caused to the surface and bottom of the wafer. Then, use external force to guide the cracks to the surface and bottom of the wafer, separating the wafer into the required size.
This report studies and analyses global SiC Wafer Laser Cutting Equipment status and future trends, helps the client to determine the SiC Wafer Laser Cutting Equipment market size of the total market opportunity by Type, by Application, by company, and by region & country. This report is a detailed and comprehensive analysis of the world market for SiC Wafer Laser Cutting Equipment, and provides market size (in Units & US$ million) and Year-over-Year growth, considering 2022 as the base year.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
To assess the competitive environment within the market including supplier revenue, market share, and company profiles.
Report Highlights
(1) Global SiC Wafer Laser Cutting Equipment market size, history data 2018-2023, and forecast data 2024 -2029, (US$ million) & (Units)
(2) Global SiC Wafer Laser Cutting Equipment sales, revenue, price by company, market share and industry ranking 2018-2023, (US$ million) & (Units)
(3) China SiC Wafer Laser Cutting Equipment sales, revenue, price by company, market share and industry ranking 2018-2023, (US$ million) & (Units)
(4) Global SiC Wafer Laser Cutting Equipment key consuming regions, consumption quantity, consumption value and demand structure
(5) Global SiC Wafer Laser Cutting Equipment key producing regions, capacity, production, and year over year growth
(6) SiC Wafer Laser Cutting Equipment industry chains, upstream, midstream and downstream
Market segment by players, this report covers
DISCO Corporation
Suzhou Delphi Laser Co
Han's Laser Technology
3D-Micromac
Synova S.A.
HGTECH
ASMPT
GHN.GIE
Wuhan DR Laser Technology
Market segment by Type, covers
Processing Sizes up to 6 Inches
Processing Sizes up to 8 Inches
Market segment by Application, can be divided into
Foundry
IDM
Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia, and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa
Key Findings from The Report:
Chapter 1: to describe SiC Wafer Laser Cutting Equipment product scope, global sales quantity, value and average price, China sales quantity, value and average price, development opportunities, challenges, trends, and policies.
Chapter 2: Global SiC Wafer Laser Cutting Equipment market share and ranking of major manufacturers, sales quantity, revenue, average price, 2018-2023
Chapter 3: China SiC Wafer Laser Cutting Equipment market share and ranking of major manufacturers, sales quantity, revenue, average price, 2018-2023
Chapter 4: Global key producing regions of SiC Wafer Laser Cutting Equipment, percent & CAGR, 2018-2029
Chapter 5: SiC Wafer Laser Cutting Equipment industry chain, upstream, medium-stream, and downstream.
Chapter 6: Segment by Type, sales quantity, average price, consumption value, percent & CAGR, 2018-2029
Chapter 7: Segment by Application, sales quantity, average price, consumption value, percent & CAGR, 2018-2029
Chapter 8: Segment in regional level, sales quantity, average price, consumption value, percent & CAGR, 2018-2029
Chapter 9: Segment in country level, sales quantity, average price, consumption value, percent & CAGR, 2018-2029
Chapter 10: Company profile, introducing the basic situation of the main companies in the market in detail, including product specifications, application, recent development, sales quantity, average price, revenue, gross margin.
Chapter 11: Conclusions
1 Market Overview
1.1 SiC Wafer Laser Cutting Equipment Definition
1.2 Global SiC Wafer Laser Cutting Equipment Market Size and Forecast
1.2.1 By Consumption Value, Global SiC Wafer Laser Cutting Equipment Market Size，2018-2029
1.2.2 By Sales Quantity, Global SiC Wafer Laser Cutting Equipment Market Size，2018-2029
1.2.3 Global SiC Wafer Laser Cutting Equipment Average Selling Price (ASP)，2018-2029
1.3 China SiC Wafer Laser Cutting Equipment Market Size and Forecast
1.3.1 By Consumption Value, China SiC Wafer Laser Cutting Equipment Market Size，2018-2029
1.3.2 By Sales Quantity, China SiC Wafer Laser Cutting Equipment Market Size，2018-2029
1.3.3 China SiC Wafer Laser Cutting Equipment Average Selling Price (ASP)， 2018-2029
1.4 Share of China SiC Wafer Laser Cutting Equipment Market with Respect to the Global Market
1.4.1 By Consumption Value, China SiC Wafer Laser Cutting Equipment Market Share in Global, 2018-2029
1.4.2 By Sales Quantity, China SiC Wafer Laser Cutting Equipment Market Share in Global, 2018-2029
1.4.3 SiC Wafer Laser Cutting Equipment Market Size: China VS Global, 2018-2029
1.5 SiC Wafer Laser Cutting Equipment Market Dynamics
1.5.1 SiC Wafer Laser Cutting Equipment Market Drivers
1.5.2 SiC Wafer Laser Cutting Equipment Market Restraints
1.5.3 SiC Wafer Laser Cutting Equipment Industry Trends
1.5.4 SiC Wafer Laser Cutting Equipment Industry Policy
2 Global Leading Manufacturers and Market Share
2.1 By Revenue of SiC Wafer Laser Cutting Equipment, Global Market Share by Company, 2018-2023
2.2 By Sales Quantity of SiC Wafer Laser Cutting Equipment, Global Market Share by Company, 2018-2023
2.3 SiC Wafer Laser Cutting Equipment Average Selling Price (ASP) by Company, 2018-2023
2.4 Global SiC Wafer Laser Cutting Equipment Participants, Market Position (Tier 1, Tier 2, and Tier 3)
2.5 Global SiC Wafer Laser Cutting Equipment Concentration Ratio
2.6 Global SiC Wafer Laser Cutting Equipment Mergers & Acquisitions, Expansion Plans
2.7 Global SiC Wafer Laser Cutting Equipment Manufacturers Product Type
2.8 Head Office and SiC Wafer Laser Cutting Equipment Production Site of Key Manufacturer
2.9 SiC Wafer Laser Cutting Equipment Capacity of Major Manufacturers and Future Plan
3 China Leading Manufacturers and Market Share
3.1 By Revenue of SiC Wafer Laser Cutting Equipment, China Market Share by Company, 2018-2023
3.2 By Sales Quantity of SiC Wafer Laser Cutting Equipment, China Market Share by Company, 2018-2023
3.3 China SiC Wafer Laser Cutting Equipment Participants, Market Position (Tier 1, Tier 2, and Tier 3)
4 Global Producing Regions
4.1 Global SiC Wafer Laser Cutting Equipment Capacity, Output and Capacity Utilization, 2018-2029
4.2 Global SiC Wafer Laser Cutting Equipment Capacity by Region
4.3 Global SiC Wafer Laser Cutting Equipment Production & Forecast by Region, 2018 VS 2022 VS 2029
4.4 Global SiC Wafer Laser Cutting Equipment Production by Region, 2018-2029
4.5 Global SiC Wafer Laser Cutting Equipment Production Market Share & Forecast by Region, 2018-2029
5 Industry Chain Analysis
5.1 SiC Wafer Laser Cutting Equipment Industry Chain
5.2 SiC Wafer Laser Cutting Equipment Upstream Analysis
5.2.1 SiC Wafer Laser Cutting Equipment Core Raw Materials
5.2.2 Main Manufacturers of SiC Wafer Laser Cutting Equipment Core Raw Materials
5.3 Midstream Analysis
5.4 Downstream Analysis
5.5 SiC Wafer Laser Cutting Equipment Production Mode
5.6 SiC Wafer Laser Cutting Equipment Procurement Model
5.7 SiC Wafer Laser Cutting Equipment Industry Sales Model and Sales Channels
5.7.1 SiC Wafer Laser Cutting Equipment Sales Model
5.7.2 SiC Wafer Laser Cutting Equipment Typical Distributors
6 Sights by Type
6.1 SiC Wafer Laser Cutting Equipment Classification
6.1.1 Processing Sizes up to 6 Inches
6.1.2 Processing Sizes up to 8 Inches
6.2 By Type, Global SiC Wafer Laser Cutting Equipment Consumption Value & CAGR, 2018 VS 2022 VS 2029
6.3 By Type, Global SiC Wafer Laser Cutting Equipment Consumption Value, 2018-2029
6.4 By Type, Global SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029
6.5 By Type, Global SiC Wafer Laser Cutting Equipment Average Selling Price (ASP), 2018-2029
7 Sights by Application
7.1 SiC Wafer Laser Cutting Equipment Segment by Application
7.1.1 Foundry
7.1.2 IDM
7.2 By Application, Global SiC Wafer Laser Cutting Equipment Consumption Value & CAGR, 2018 VS 2022 VS 2029
7.3 By Application, Global SiC Wafer Laser Cutting Equipment Consumption Value, 2018-2029
7.4 By Application, Global SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029
7.5 By Application, Global SiC Wafer Laser Cutting Equipment Price, 2018-2029
8 Sales Sights by Region
8.1 By Region, Global SiC Wafer Laser Cutting Equipment Consumption Value, 2018 VS 2022 VS 2029
8.2 By Region, Global SiC Wafer Laser Cutting Equipment Consumption Value, 2018-2029
8.3 By Region, Global SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029
8.4 North America
8.4.1 North America SiC Wafer Laser Cutting Equipment & Forecasts, 2018-2029
8.4.2 By Country, North America SiC Wafer Laser Cutting Equipment Market Size Market Share
8.5 Europe
8.5.1 Europe SiC Wafer Laser Cutting Equipment Market Size & Forecasts, 2018-2029
8.5.2 By Country, Europe SiC Wafer Laser Cutting Equipment Market Size Market Share
8.6 Asia Pacific
8.6.1 Asia Pacific SiC Wafer Laser Cutting Equipment Market Size & Forecasts, 2018-2029
8.6.2 By Country/Region, Asia Pacific SiC Wafer Laser Cutting Equipment Market Size Market Share
8.7 South America
8.7.1 South America SiC Wafer Laser Cutting Equipment Market Size & Forecasts, 2018-2029
8.7.2 By Country, South America SiC Wafer Laser Cutting Equipment Market Size Market Share
8.8 Middle East & Africa
9 Sales Sights by Country Level
9.1 By Country, Global SiC Wafer Laser Cutting Equipment Market Size & CAGR, 2018 VS 2022 VS 2029
9.2 By Country, Global SiC Wafer Laser Cutting Equipment Consumption Value, 2018-2029
9.3 By Country, Global SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029
9.4 U.S.
9.4.1 U.S. SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
9.4.2 By Type, U.S. SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.4.3 By Application, U.S. SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.5 Europe
9.5.1 Europe SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
9.5.2 By Type, Europe SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.5.3 By Application, Europe SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.6 China
9.6.1 China SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
9.6.2 By Type, China SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.6.3 By Application, China SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.7 Japan
9.7.1 Japan SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
9.7.2 By Type, Japan SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.7.3 By Application, Japan SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.8 South Korea
9.8.1 South Korea SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
9.8.2 By Type, South Korea SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.8.3 By Application, South Korea SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.9 Southeast Asia
9.9.1 Southeast Asia SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
9.9.2 By Type, Southeast Asia SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.9.3 By Application, Southeast Asia SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.10 India
9.10.1 India SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
9.10.2 By Type, India SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.10.3 By Application, India SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.11 Middle East & Africa
9.11.1 Middle East & Africa SiC Wafer Laser Cutting Equipment Market Size, 2018-2029
9.11.2 By Type, Middle East & Africa SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
9.11.3 By Application, Middle East & Africa SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
10 Manufacturers Profile
10.1 DISCO Corporation
10.1.1 DISCO Corporation Company Information, Head Office, Market Area, and Industry Position
10.1.2 DISCO Corporation SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
10.1.3 DISCO Corporation SiC Wafer Laser Cutting Equipment Sales Quantity, Revenue, Price and Gross Margin, 2018-2023
10.1.4 DISCO Corporation Company Profile and Main Business
10.1.5 DISCO Corporation Recent Developments
10.2 Suzhou Delphi Laser Co
10.2.1 Suzhou Delphi Laser Co Company Information, Head Office, Market Area, and Industry Position
10.2.2 Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
10.2.3 Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Sales Quantity, Revenue, Price and Gross Margin, 2018-2023
10.2.4 Suzhou Delphi Laser Co Company Profile and Main Business
10.2.5 Suzhou Delphi Laser Co Recent Developments
10.3 Han's Laser Technology
10.3.1 Han's Laser Technology Company Information, Head Office, Market Area, and Industry Position
10.3.2 Han's Laser Technology SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
10.3.3 Han's Laser Technology SiC Wafer Laser Cutting Equipment Sales Quantity, Revenue, Price and Gross Margin, 2018-2023
10.3.4 Han's Laser Technology Company Profile and Main Business
10.3.5 Han's Laser Technology Recent Developments
10.4 3D-Micromac
10.4.1 3D-Micromac Company Information, Head Office, Market Area, and Industry Position
10.4.2 3D-Micromac SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
10.4.3 3D-Micromac SiC Wafer Laser Cutting Equipment Sales Quantity, Revenue, Price and Gross Margin, 2018-2023
10.4.4 3D-Micromac Company Profile and Main Business
10.4.5 3D-Micromac Recent Developments
10.5 Synova S.A.
10.5.1 Synova S.A. Company Information, Head Office, Market Area, and Industry Position
10.5.2 Synova S.A. SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
10.5.3 Synova S.A. SiC Wafer Laser Cutting Equipment Sales Quantity, Revenue, Price and Gross Margin, 2018-2023
10.5.4 Synova S.A. Company Profile and Main Business
10.5.5 Synova S.A. Recent Developments
10.6 HGTECH
10.6.1 HGTECH Company Information, Head Office, Market Area, and Industry Position
10.6.2 HGTECH SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
10.6.3 HGTECH SiC Wafer Laser Cutting Equipment Sales Quantity, Revenue, Price and Gross Margin, 2018-2023
10.6.4 HGTECH Company Profile and Main Business
10.6.5 HGTECH Recent Developments
10.7 ASMPT
10.7.1 ASMPT Company Information, Head Office, Market Area, and Industry Position
10.7.2 ASMPT SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
10.7.3 ASMPT SiC Wafer Laser Cutting Equipment Sales Quantity, Revenue, Price and Gross Margin, 2018-2023
10.7.4 ASMPT Company Profile and Main Business
10.7.5 ASMPT Recent Developments
10.8 GHN.GIE
10.8.1 GHN.GIE Company Information, Head Office, Market Area, and Industry Position
10.8.2 GHN.GIE SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
10.8.3 GHN.GIE SiC Wafer Laser Cutting Equipment Sales Quantity, Revenue, Price and Gross Margin, 2018-2023
10.8.4 GHN.GIE Company Profile and Main Business
10.8.5 GHN.GIE Recent Developments
10.9 Wuhan DR Laser Technology
10.9.1 Wuhan DR Laser Technology Company Information, Head Office, Market Area, and Industry Position
10.9.2 Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
10.9.3 Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Sales Quantity, Revenue, Price and Gross Margin, 2018-2023
10.9.4 Wuhan DR Laser Technology Company Profile and Main Business
10.9.5 Wuhan DR Laser Technology Recent Developments
11 Conclusion
12 Appendix
12.1 Research Methodology
12.2 Data Source
12.2.1 Secondary Sources
12.2.2 Primary Sources
12.3 Market Estimation Model
12.4 Disclaimer
Table 1. SiC Wafer Laser Cutting Equipment Consumption Value & CAGR: China VS Global, 2018-2029, US$ Million
Table 2. SiC Wafer Laser Cutting Equipment Market Restraints
Table 3. SiC Wafer Laser Cutting Equipment Market Trends
Table 4. SiC Wafer Laser Cutting Equipment Industry Policy
Table 5. Global SiC Wafer Laser Cutting Equipment Revenue by Company, 2018-2023, US$ million, Ranked Based on Revenue in 2022
Table 6. Global SiC Wafer Laser Cutting Equipment Revenue Share by Company, 2018-2023, Ranked by Data of 2022
Table 7. Global SiC Wafer Laser Cutting Equipment Sales Quantity by Company, (2018-2023) & (Units), Ranked Based on Sales in 2022
Table 8. Global SiC Wafer Laser Cutting Equipment Sales Quantity by Company, 2018-2023, Ranked by Data of 2022
Table 9. Global SiC Wafer Laser Cutting Equipment Average Selling Price (ASP) by Company, (2018-2023) & (US$/Unit)
Table 10. Global SiC Wafer Laser Cutting Equipment Manufacturers Market Concentration Ratio (CR3 and HHI)
Table 11. Global SiC Wafer Laser Cutting Equipment Mergers & Acquisitions, Expansion Plans
Table 12. Global SiC Wafer Laser Cutting Equipment Manufacturers Product Type
Table 13. Head Office and SiC Wafer Laser Cutting Equipment Production Site of Key Manufacturer
Table 14. SiC Wafer Laser Cutting Equipment Capacity of Major Manufacturers and Future Plan
Table 15. China SiC Wafer Laser Cutting Equipment Revenue by Company, 2018-2023, US$ million, Ranked Based on Revenue in 2022
Table 16. China SiC Wafer Laser Cutting Equipment Sales Quantity by Company, (2018-2023) & (Units), Ranked Based on Sales in 2022
Table 17. China SiC Wafer Laser Cutting Equipment Sales Quantity by Company, 2018-2023, Ranked by Data of 2022
Table 18. Global SiC Wafer Laser Cutting Equipment Production & Forecast by Region, 2018 VS 2022 VS 2029, (Units)
Table 19. Global SiC Wafer Laser Cutting Equipment Production by Region, 2018-2023, (Units)
Table 20. Global SiC Wafer Laser Cutting Equipment Production Forecast by Region, 2024-2029, (Units)
Table 21. Global Key Players of SiC Wafer Laser Cutting Equipment Upstream (Raw Materials)
Table 22. Global SiC Wafer Laser Cutting Equipment Typical Customers
Table 23. SiC Wafer Laser Cutting Equipment Typical Distributors
Table 24. By Type, Global SiC Wafer Laser Cutting Equipment Consumption Value & CAGR, 2018 VS 2022 VS 2029, US$ Million
Table 25. By Application, Global SiC Wafer Laser Cutting Equipment Consumption Value & CAGR, 2018 VS 2022 VS 2029, US$ Million
Table 26. By Region, Global SiC Wafer Laser Cutting Equipment Consumption Value, 2018 VS 2022 VS 2029, US$ Million
Table 27. By Region, Global SiC Wafer Laser Cutting Equipment Consumption Value, 2018-2029, US$ Million
Table 28. By Region, Global SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029, (Units)
Table 29. By Country, Global SiC Wafer Laser Cutting Equipment Consumption Value & CAGR, 2018 VS 2022 VS 2029, US$ Million
Table 30. By Country, Global SiC Wafer Laser Cutting Equipment Consumption Value, 2018-2029, US$ Million
Table 31. By Country, Global SiC Wafer Laser Cutting Equipment Consumption Value Market Share, 2018-2029
Table 32. By Country, Global SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029, (Units)
Table 33. By Country, Global SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2018-2029
Table 34. DISCO Corporation Company Information, Head Office, Market Area, and Industry Position
Table 35. DISCO Corporation SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
Table 36. DISCO Corporation SiC Wafer Laser Cutting Equipment Sales Quantity (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin, 2018-2023
Table 37. DISCO Corporation Company Profile and Main Business
Table 38. DISCO Corporation Recent Developments
Table 39. Suzhou Delphi Laser Co Company Information, Head Office, Market Area, and Industry Position
Table 40. Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
Table 41. Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Sales Quantity (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin, 2018-2023
Table 42. Suzhou Delphi Laser Co Company Profile and Main Business
Table 43. Suzhou Delphi Laser Co Recent Developments
Table 44. Han's Laser Technology Company Information, Head Office, Market Area, and Industry Position
Table 45. Han's Laser Technology SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
Table 46. Han's Laser Technology SiC Wafer Laser Cutting Equipment Sales Quantity (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin, 2018-2023
Table 47. Han's Laser Technology Company Profile and Main Business
Table 48. Han's Laser Technology Recent Developments
Table 49. 3D-Micromac Company Information, Head Office, Market Area, and Industry Position
Table 50. 3D-Micromac SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
Table 51. 3D-Micromac SiC Wafer Laser Cutting Equipment Sales Quantity (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin, 2018-2023
Table 52. 3D-Micromac Company Profile and Main Business
Table 53. 3D-Micromac Recent Developments
Table 54. Synova S.A. Company Information, Head Office, Market Area, and Industry Position
Table 55. Synova S.A. SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
Table 56. Synova S.A. SiC Wafer Laser Cutting Equipment Sales Quantity (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin, 2018-2023
Table 57. Synova S.A. Company Profile and Main Business
Table 58. Synova S.A. Recent Developments
Table 59. HGTECH Company Information, Head Office, Market Area, and Industry Position
Table 60. HGTECH SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
Table 61. HGTECH SiC Wafer Laser Cutting Equipment Sales Quantity (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin, 2018-2023
Table 62. HGTECH Company Profile and Main Business
Table 63. HGTECH Recent Developments
Table 64. ASMPT Company Information, Head Office, Market Area, and Industry Position
Table 65. ASMPT SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
Table 66. ASMPT SiC Wafer Laser Cutting Equipment Sales Quantity (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin, 2018-2023
Table 67. ASMPT Company Profile and Main Business
Table 68. ASMPT Recent Developments
Table 69. GHN.GIE Company Information, Head Office, Market Area, and Industry Position
Table 70. GHN.GIE SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
Table 71. GHN.GIE SiC Wafer Laser Cutting Equipment Sales Quantity (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin, 2018-2023
Table 72. GHN.GIE Company Profile and Main Business
Table 73. GHN.GIE Recent Developments
Table 74. Wuhan DR Laser Technology Company Information, Head Office, Market Area, and Industry Position
Table 75. Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Models, Specifications, and Application
Table 76. Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Sales Quantity (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin, 2018-2023
Table 77. Wuhan DR Laser Technology Company Profile and Main Business
Table 78. Wuhan DR Laser Technology Recent Developments
List of Figures
Figure 1. SiC Wafer Laser Cutting Equipment Picture
Figure 2. Global SiC Wafer Laser Cutting Equipment Consumption Value, (US$ million) & (2018-2029)
Figure 3. Global SiC Wafer Laser Cutting Equipment Sales Quantity, (Units) & (2018-2029)
Figure 4. Global SiC Wafer Laser Cutting Equipment Average Selling Price (ASP), (2018-2029) & (US$/Unit)
Figure 5. China SiC Wafer Laser Cutting Equipment Consumption Value, (US$ million) & (2018-2029)
Figure 6. China SiC Wafer Laser Cutting Equipment Sales Quantity (Units) & (2018-2029)
Figure 7. China SiC Wafer Laser Cutting Equipment Average Selling Price (ASP), (US$/Unit) & (2018-2029)
Figure 8. By Consumption Value, China SiC Wafer Laser Cutting Equipment Market Share of Global, 2018-2029
Figure 9. By Sales Quantity, China SiC Wafer Laser Cutting Equipment Market Share of Global, 2018-2029
Figure 10. Global SiC Wafer Laser Cutting Equipment Market Share by Company, (Tier 1, Tier 2, and Tier 3), 2022
Figure 11. China SiC Wafer Laser Cutting Equipment Key Participants, Market Share, 2022
Figure 12. Global SiC Wafer Laser Cutting Equipment Capacity, Production and Capacity Utilization, 2018-2029
Figure 13. Global SiC Wafer Laser Cutting Equipment Capacity Market Share by Region, 2022 VS 2029
Figure 14. Global SiC Wafer Laser Cutting Equipment Production Market Share & Forecast by Region, 2018-2029
Figure 15. SiC Wafer Laser Cutting Equipment Industry Chain
Figure 16. SiC Wafer Laser Cutting Equipment Procurement Model
Figure 17. SiC Wafer Laser Cutting Equipment Sales Model
Figure 18. SiC Wafer Laser Cutting Equipment Sales Channels, Direct Sales, and Distribution
Figure 19. Processing Sizes up to 6 Inches
Figure 20. Processing Sizes up to 8 Inches
Figure 21. By Type, Global SiC Wafer Laser Cutting Equipment Consumption Value, 2018-2029, US$ Million
Figure 22. By Type, Global SiC Wafer Laser Cutting Equipment Consumption Value Market Share, 2018-2029
Figure 23. By Type, Global SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029, (Units)
Figure 24. By Type, Global SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2018-2029
Figure 25. By Type, Global SiC Wafer Laser Cutting Equipment Average Selling Price (ASP), 2018-2029, (US$/Unit)
Figure 26. Foundry
Figure 27. IDM
Figure 28. By Application, Global SiC Wafer Laser Cutting Equipment Consumption Value, 2018-2029, US$ Million
Figure 29. By Application, Global SiC Wafer Laser Cutting Equipment Consumption Value Market Share, 2018-2029
Figure 30. By Application, Global SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029, (Units)
Figure 31. By Application, Global SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2018-2029
Figure 32. By Application, Global SiC Wafer Laser Cutting Equipment Average Selling Price (ASP), 2018-2029, (US$/Unit)
Figure 33. By Region, Global SiC Wafer Laser Cutting Equipment Consumption Value Market Share, 2018-2029
Figure 34. By Region, Global SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2018-2029
Figure 35. North America SiC Wafer Laser Cutting Equipment Consumption Value & Forecasts, 2018-2029, US$ Million
Figure 36. By Country, North America SiC Wafer Laser Cutting Equipment Consumption Value Market Share, 2022
Figure 37. Europe SiC Wafer Laser Cutting Equipment Consumption Value & Forecasts, 2018-2029, US$ Million
Figure 38. By Country, Europe SiC Wafer Laser Cutting Equipment Consumption Value Market Share, 2022
Figure 39. Asia Pacific SiC Wafer Laser Cutting Equipment Consumption Value & Forecasts, 2018-2029, US$ Million
Figure 40. By Country/Region, Asia Pacific SiC Wafer Laser Cutting Equipment Consumption Value Market Share, 2022
Figure 41. South America SiC Wafer Laser Cutting Equipment Consumption Value & Forecasts, 2018-2029, US$ Million
Figure 42. By Country, South America SiC Wafer Laser Cutting Equipment Consumption Value Market Share, 2022
Figure 43. Middle East & Africa SiC Wafer Laser Cutting Equipment Consumption Value & Forecasts, 2018-2029, US$ Million
Figure 44. U.S. SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029, (Units)
Figure 45. By Type, U.S. SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 46. By Application, U.S. SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 47. Europe SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029, (Units)
Figure 48. By Type, Europe SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 49. By Application, Europe SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 50. China SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029, (Units)
Figure 51. By Type, China SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 52. By Application, China SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 53. Japan SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029, (Units)
Figure 54. By Type, Japan SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 55. By Application, Japan SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 56. South Korea SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029, (Units)
Figure 57. By Type, South Korea SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 58. By Application, South Korea SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 59. Southeast Asia SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029, (Units)
Figure 60. By Type, Southeast Asia SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 61. By Application, Southeast Asia SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 62. India SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029, (Units)
Figure 63. By Type, India SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 64. By Application, India SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 65. Middle East & Africa SiC Wafer Laser Cutting Equipment Sales Quantity, 2018-2029, (Units)
Figure 66. By Type, Middle East & Africa SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 67. By Application, Middle East & Africa SiC Wafer Laser Cutting Equipment Sales Quantity Market Share, 2022 VS 2029
Figure 68. Research Methodology
Figure 69. Breakdown of Primary Interviews
Figure 70. Bottom-up and Top-down Approaches
Figure 71. Top-down Approaches
Methodology/Research Approach
This research study involved the extensive usage of both primary and secondary data sources. The research process involved the study of various factors affecting the industry, including the government policy, market environment, competitive landscape, historical data, present trends in the market, technological innovation, upcoming technologies and the technical progress in related industry, and market risks, opportunities, market barriers and challenges. The following illustrative figure shows the market research methodology applied in this report.Research Programs/Design
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Market Size Estimation
Top-down and bottom-up approaches are used to validate the global Voluntary Carbon Offset market size market and estimate the market size for Company, regions segments, product segments and Application (end users).
The market estimations in this report are based on the marketed sale price of Voluntary Carbon Offset (excluding any discounts provided by the player, distributor, wholesaler or traders). The percentage splits, market share, and breakdowns of the product segments are derived on the basis of weights assigned to each of the segments on the basis of their utilization rate and average sale price. The regional splits of the overall Voluntary Carbon Offset market and its sub-segments are based on the percentage adoption or utilization of the given product in the respective region or country.
Major Company in the market is identified through secondary research and their market revenues determined through primary and secondary research. Secondary research included the research of the annual and financial reports of the top Company; whereas, primary research included extensive interviews of key opinion leaders and industry experts such as experienced front-line staff, directors, CEOs and marketing executives. The percentage splits, market share, Growth Rate and breakdowns of the product markets are determined through using secondary sources and verified through the primary sources.
All possible factors that influence the markets included in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data. The market size for top-level markets and sub-segments is normalized, and the effect of inflation, economic downturns, and regulatory & policy changes or other factors are not accounted for in the market forecast. This data is combined and added with detailed inputs and analysis from Market Intellix and presented in this report
The following figure shows an illustrative representation of the overall market size estimation process used for this study.
Market Breakdown and Data Triangulation
After complete market engineering with calculations for market statistics; market size estimations; market forecasting; market breakdown; and data triangulation, extensive primary research was conducted to gather information and verify and validate the critical numbers arrived at. In the complete market engineering process, both top-down and bottom-up approaches were extensively used, along with several data triangulation methods, to perform market estimation and market forecasting for the overall market segments and sub-segments listed in this report. Extensive qualitative and further quantitative analysis is also done from all the numbers arrived at in the complete market engineering process to list key information throughout the report.
Data Source
Secondary Sources
Secondary sources include such as press releases, annual reports, non-profit organizations, industry associations, governmental agencies and customs data, etc. This research study involves the usage of widespread secondary sources, directories, databases such as Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), and TRADING ECONOMICS, and News Network, statista, Federal Reserve Economic Data, annual reports, BIS Statistics, ICIS; company house documents; CAS(American Chemical Society); investor presentations; and SEC filings of companies. Secondary research was used to identify and collect information useful for the extensive, technical, market-oriented, and Hospitals study of the Voluntary Carbon Offset market. It was also used to obtain important information about the top companies, market classification and segmentation according to industry trends to the bottom-most level, and key developments related to market and technology perspectives.
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Primary Sources
In the primary research process, various sources from both the supply and demand sides were interviewed to obtain qualitative and quantitative information for this report. The primary sources from the supply side include product Company (and their competitors), opinion leaders, industry experts, research institutions, distributors, dealer and traders, as well as the raw materials suppliers and producers, etc.
The primary sources from the demand side include industry experts such as business leaders, marketing and sales directors, technology and innovation directors, supply chain executive, end use (product buyers), and related key executives from various key companies and organizations operating in the global market.
Primary research was conducted to identify segmentation Type, product price range, product Application, key Company, raw materials supply and the downstream demand, industry status and outlook, and key market dynamics such as risks, influence factors, opportunities, market barriers, industry trends, and key player strategies.
Key Executives Interviewed
Key Data Information from Primary Sources
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