Global Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Region: Trend Forecast and Growth Opportunity
Global substrate-like PCB (SLP) market will reach $5,983.6 million by 2031, growing by 14.9% annually over 2021-2031, driven by SLP’s ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activities for technological advancements, the rising prevalence of smart consumer electronics such as smartphones and wearable devices, and the growing demand for effective connectivity solutions and the growing trend of miniaturization.
Highlighted with 78 tables and 69 figures, this 144-page report “Global Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Region: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire global substrate-like PCB (SLP) market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global substrate-like PCB (SLP) market in every aspect of the classification from perspectives of Inspection Technology, Line/Space, Application, and Region.
Based on Inspection Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Automated Optical Inspection (AOI)
• Direct Imaging (DI)
• Automated Optical Shaping (AOS)
Based on Line/Space, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• 25/25 and 30/30 μm
• Less than 25/25 μm
By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Consumer Electronics
• Automotive Industry
• Medical Industry
• Industrial Use
• Computing and Communications
• Other Applications
Geographically, the following regions together with the listed national/local markets are fully investigated:
• North America (U.S., Canada, and Mexico)
• Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
• APAC (Japan, China, South Korea, Australia, India, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines)
• South America (Brazil, Chile, Argentina, Rest of South America)
• MEA (UAE，Saudi Arabia， South Africa and Rest of MEA)
For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of all regional markets by country and split of each national market by Inspection Technology, Line/Space and Application over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
China Circuit Technology Corporation
Compaq Manufacturing Co., Ltd.
Daeduck Electronics Co., Ltd.
HannStar Board Corporation
Ibiden Co., Ltd.
Kinsus Interconnect Technology Corp
Korea Circuit Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.
Shenzhen Fastprint Circuit Tech Co., Ltd.
Symtek Automation Asia Co., Ltd.
TTM Technologies, Inc.
Unimicron Technology Corp.
Zhen Ding Tech. Group Technology Holding Limited
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 8
1.1 Industry Definition and Research Scope 8
1.1.1 Industry Definition 8
1.1.2 Research Scope 9
1.2 Research Methodology 12
1.2.1 Overview of Market Research Methodology 12
1.2.2 Market Assumption 13
1.2.3 Secondary Data 13
1.2.4 Primary Data 13
1.2.5 Data Filtration and Model Design 14
1.2.6 Market Size/Share Estimation 15
1.2.7 Research Limitations 16
1.3 Executive Summary 17
2 Market Overview and Dynamics 19
2.1 Market Size and Forecast 19
2.1.1 Impact of COVID-19 on World Economy 20
2.1.2 Impact of COVID-19 on the Market 22
2.2 Major Growth Drivers 24
2.3 Market Restraints and Challenges 28
2.4 Emerging Opportunities and Market Trends 31
2.5 Porter’s Fiver Forces Analysis 35
3 Segmentation of Global Market by Inspection Technology 39
3.1 Market Overview by Inspection Technology 39
3.2 Automated Optical Inspection (AOI) 41
3.3 Direct Imaging (DI) 42
4 Segmentation of Global Market by Line/Space 43
4.1 Market Overview by Line/Space 43
4.2 25/25 and 30/30 μm 45
4.3 Less than 25/25 μm 46
5 Segmentation of Global Market by Application 47
5.1 Market Overview by Application 47
5.2 Consumer Electronics 49
5.3 Automotive Industry 50
5.4 Medical Industry 51
5.5 Industrial Use 52
5.6 Computing and Communications 53
5.7 Other Applications 54
6 Segmentation of Global Market by Region 55
6.1 Geographic Market Overview 2021-2031 55
6.2 North America Market 2021-2031 by Country 59
6.2.1 Overview of North America Market 59
6.2.2 U.S. 63
6.2.3 Canada 66
6.2.4 Mexico 68
6.3 European Market 2021-2031 by Country 70
6.3.1 Overview of European Market 70
6.3.2 Germany 74
6.3.3 U.K. 76
6.3.4 France 78
6.3.5 Spain 80
6.3.6 Italy 82
6.3.7 Netherlands 84
6.3.8 Rest of European Market 86
6.4 Asia-Pacific Market 2021-2031 by Country 88
6.4.1 Overview of Asia-Pacific Market 88
6.4.2 Japan 92
6.4.3 China 95
6.4.4 Australia 97
6.4.5 India 99
6.4.6 South Korea 101
6.4.7 Rest of APAC Region 103
6.5 South America Market 2021-2031 by Country 105
6.5.1 Argentina 108
6.5.2 Brazil 110
6.5.3 Chile 112
6.5.4 Rest of South America Market 114
6.6 MEA Market 2021-2031 by Country 115
6.6.1 UAE 118
6.6.2 Saudi Arabia 120
6.6.3 South Africa 122
6.6.4 Other National Markets 124
7 Competitive Landscape 125
7.1 Overview of Key Vendors 125
7.2 New Product Launch, Partnership, Investment, and M&A 128
7.3 Company Profiles 129
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) 129
China Circuit Technology Corporation 131
Compaq Manufacturing Co., Ltd. 132
Daeduck Electronics Co., Ltd. 133
HannStar Board Corporation 134
Ibiden Co., Ltd. 135
Kinsus Interconnect Technology Corp 136
Korea Circuit Co., Ltd. 137
Samsung Electro-Mechanics Co., Ltd. 138
Shenzhen Fastprint Circuit Tech Co., Ltd. 139
Symtek Automation Asia Co., Ltd. 140
TTM Technologies, Inc. 141
Unimicron Technology Corp. 142
Zhen Ding Tech. Group Technology Holding Limited 143
RELATED REPORTS 144
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
China Circuit Technology Corporation
Compaq Manufacturing Co., Ltd.
Daeduck Electronics Co., Ltd.
HannStar Board Corporation
Ibiden Co., Ltd.
Kinsus Interconnect Technology Corp
Korea Circuit Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.
Shenzhen Fastprint Circuit Tech Co., Ltd.
Symtek Automation Asia Co., Ltd.
TTM Technologies, Inc.
Unimicron Technology Corp.
Zhen Ding Tech. Group Technology Holding Limited
Methodology/Research Approach
This research study involved the extensive usage of both primary and secondary data sources. The research process involved the study of various factors affecting the industry, including the government policy, market environment, competitive landscape, historical data, present trends in the market, technological innovation, upcoming technologies and the technical progress in related industry, and market risks, opportunities, market barriers and challenges. The following illustrative figure shows the market research methodology applied in this report.Research Programs/Design
| Historical Data (2015-2019) |
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Market Size Estimation
Top-down and bottom-up approaches are used to validate the global Voluntary Carbon Offset market size market and estimate the market size for Company, regions segments, product segments and Application (end users).
The market estimations in this report are based on the marketed sale price of Voluntary Carbon Offset (excluding any discounts provided by the player, distributor, wholesaler or traders). The percentage splits, market share, and breakdowns of the product segments are derived on the basis of weights assigned to each of the segments on the basis of their utilization rate and average sale price. The regional splits of the overall Voluntary Carbon Offset market and its sub-segments are based on the percentage adoption or utilization of the given product in the respective region or country.
Major Company in the market is identified through secondary research and their market revenues determined through primary and secondary research. Secondary research included the research of the annual and financial reports of the top Company; whereas, primary research included extensive interviews of key opinion leaders and industry experts such as experienced front-line staff, directors, CEOs and marketing executives. The percentage splits, market share, Growth Rate and breakdowns of the product markets are determined through using secondary sources and verified through the primary sources.
All possible factors that influence the markets included in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data. The market size for top-level markets and sub-segments is normalized, and the effect of inflation, economic downturns, and regulatory & policy changes or other factors are not accounted for in the market forecast. This data is combined and added with detailed inputs and analysis from Market Intellix and presented in this report
The following figure shows an illustrative representation of the overall market size estimation process used for this study.
Market Breakdown and Data Triangulation
After complete market engineering with calculations for market statistics; market size estimations; market forecasting; market breakdown; and data triangulation, extensive primary research was conducted to gather information and verify and validate the critical numbers arrived at. In the complete market engineering process, both top-down and bottom-up approaches were extensively used, along with several data triangulation methods, to perform market estimation and market forecasting for the overall market segments and sub-segments listed in this report. Extensive qualitative and further quantitative analysis is also done from all the numbers arrived at in the complete market engineering process to list key information throughout the report.
Data Source
Secondary Sources
Secondary sources include such as press releases, annual reports, non-profit organizations, industry associations, governmental agencies and customs data, etc. This research study involves the usage of widespread secondary sources, directories, databases such as Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), and TRADING ECONOMICS, and News Network, statista, Federal Reserve Economic Data, annual reports, BIS Statistics, ICIS; company house documents; CAS(American Chemical Society); investor presentations; and SEC filings of companies. Secondary research was used to identify and collect information useful for the extensive, technical, market-oriented, and Hospitals study of the Voluntary Carbon Offset market. It was also used to obtain important information about the top companies, market classification and segmentation according to industry trends to the bottom-most level, and key developments related to market and technology perspectives.
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Primary Sources
In the primary research process, various sources from both the supply and demand sides were interviewed to obtain qualitative and quantitative information for this report. The primary sources from the supply side include product Company (and their competitors), opinion leaders, industry experts, research institutions, distributors, dealer and traders, as well as the raw materials suppliers and producers, etc.
The primary sources from the demand side include industry experts such as business leaders, marketing and sales directors, technology and innovation directors, supply chain executive, end use (product buyers), and related key executives from various key companies and organizations operating in the global market.
Primary research was conducted to identify segmentation Type, product price range, product Application, key Company, raw materials supply and the downstream demand, industry status and outlook, and key market dynamics such as risks, influence factors, opportunities, market barriers, industry trends, and key player strategies.
Key Executives Interviewed
Key Data Information from Primary Sources
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