According to Latest Study, the global market for 2.5D and 3D IC Packaging should grow from US$ million in 2023 to US$ million by 2030, with a CAGR of % for the period of 2024-2030.

China 2.5D and 3D IC Packaging market should grow from US$ million in 2023 to US$ million by 2030, with a CAGR of % for the period of 2024-2030.

The United States 2.5D and 3D IC Packaging market should grow from US$ million in 2023 to US$ million by 2030, with a CAGR of % for the period of 2024-2030.

In terms of type, 2.5D segment holds a share about % in 2024 and will reach % in 2030; while in terms of application, Consumer Electronics has a share approximately % in 2023 and will grow at a CAGR % during 2024 and 2030.

The global key manufacturers of 2.5D and 3D IC Packaging include ASE Technology, Samsung Electronics, Toshiba, STMicroelectronics, Xilinx, Intel, Micron Technology, TSMC and SK Hynix, etc. In 2022, the global top five players hold a share approximately % in terms of revenue.

In 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer for achieving extremely high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for shortest interconnect and smallest package footprint.

This report aims to provide a comprehensive study of the global market for 2.5D and 3D IC Packaging. Report Highlights:

(1) Global 2.5D and 3D IC Packaging market size (value), history data from 2019-2023 and forecast data from 2024 to 2030.

(2) Global 2.5D and 3D IC Packaging market competitive situation, revenue and market share, from 2019 to 2023.

(3) China 2.5D and 3D IC Packaging market competitive situation, revenue and market share, from 2019 to 2023.

(4) Global 2.5D and 3D IC Packaging segment by region (or country), key regions cover the United States, Europe, Japan, South Korea, Southeast Asia and India, etc.

(5) Global 2.5D and 3D IC Packaging segment by type and by application and regional segment by type and by application.

(6) 2.5D and 3D IC Packaging industry supply chain, upstream, midstream and downstream analysis.

Market segment by regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia, Italy and Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)

South America (Brazil, Rest of South America)

Middle East & Africa

Market segment by type, covers

2.5D

3D TSV

3D Wafer-level Chip-scale Packaging

Market segment by application, can be divided into

Consumer Electronics

Medical Devices

Communications and Telecom

Automotive

Other

Market segment by players, this report covers

ASE Technology

Samsung Electronics

Toshiba

STMicroelectronics

Xilinx

Intel

Micron Technology

TSMC

SK Hynix

Amkor Technology

GlobalFoundries

SanDisk (Western Digital)

Synopsys

Invensas

Siliconware Precision Industries

Jiangsu Changjiang Electronics

Powertech Technology

1 Market Overview

1.1 Product Overview and Scope of 2.5D and 3D IC Packaging

1.2 Global 2.5D and 3D IC Packaging Market Size and Forecast

1.3 China 2.5D and 3D IC Packaging Market Size and Forecast

1.4 China Market Percentage in Global

1.4.1 By Revenue, China 2.5D and 3D IC Packaging Share in Global Market, 2019-2030

1.4.2 2.5D and 3D IC Packaging Market Size: China VS Global, 2019-2030

1.5 2.5D and 3D IC Packaging Market Dynamics

1.5.1 2.5D and 3D IC Packaging Market Drivers

1.5.2 2.5D and 3D IC Packaging Market Restraints

1.5.3 2.5D and 3D IC Packaging Industry Trends

1.5.4 2.5D and 3D IC Packaging Industry Policy

2 Global Competitive Situation by Company

2.1 Global 2.5D and 3D IC Packaging Revenue by Company (2019-2024)

2.2 Global 2.5D and 3D IC Packaging Participants, Market Position (Tier 1, Tier 2 and Tier 3)

2.3 Global 2.5D and 3D IC Packaging Concentration Ratio

2.4 Global 2.5D and 3D IC Packaging Mergers & Acquisitions, Expansion Plans

2.5 Global 2.5D and 3D IC Packaging Manufacturers Product Type

3 China Competitive Situation by Company

3.1 China 2.5D and 3D IC Packaging Revenue by Company (2019-2024)

3.2 China 2.5D and 3D IC Packaging 2.5D and 3D IC Packaging Participants, Market Position (Tier 1, Tier 2 and Tier 3)

3.3 China 2.5D and 3D IC Packaging, Revenue Percentage of Local Players VS Foreign Manufacturers (2019-2024)

4 Industry Chain Analysis

4.1 2.5D and 3D IC Packaging Industry Chain

4.2 2.5D and 3D IC Packaging Upstream Analysis

4.3 2.5D and 3D IC Packaging Midstream Analysis

4.4 2.5D and 3D IC Packaging Downstream Analysis

5 Sights by Type

5.1 2.5D and 3D IC Packaging Classification

5.1.1 2.5D

5.1.2 3D TSV

5.1.3 3D Wafer-level Chip-scale Packaging

5.2 By Type, Global 2.5D and 3D IC Packaging Market Size & CAGR, 2019 VS 2024 VS 2030

5.3 By Type, Global 2.5D and 3D IC Packaging Revenue, 2019-2030

6 Sights by Application

6.1 2.5D and 3D IC Packaging Segment by Application

6.1.1 Consumer Electronics

6.1.2 Medical Devices

6.1.3 Communications and Telecom

6.1.4 Automotive

6.1.5 Other

6.2 By Application, Global 2.5D and 3D IC Packaging Market Size & CAGR, 2019 VS 2024 VS 2030

6.3 By Application, Global 2.5D and 3D IC Packaging Revenue, 2019-2030

7 Sales Sights by Region

7.1 By Region, Global 2.5D and 3D IC Packaging Market Size, 2019 VS 2024 VS 2030

7.2 By Region, Global 2.5D and 3D IC Packaging Market Size, 2019-2030

7.3 North America

7.3.1 North America 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030

7.3.2 By Country, North America 2.5D and 3D IC Packaging Market Size Market Share

7.4 Europe

7.4.1 Europe 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030

7.4.2 By Country, Europe 2.5D and 3D IC Packaging Market Size Market Share

7.5 Asia Pacific

7.5.1 Asia Pacific 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030

7.5.2 By Country/Region, Asia Pacific 2.5D and 3D IC Packaging Market Size Market Share

7.6 South America

7.6.1 South America 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030

7.6.2 By Country, South America 2.5D and 3D IC Packaging Market Size Market Share

7.7 Middle East & Africa

8 Sights by Country Level

8.1 By Country, Global 2.5D and 3D IC Packaging Market Size & CAGR，2019 VS 2024 VS 2030

8.2 By Country, Global 2.5D and 3D IC Packaging Market Size, 2019-2030

8.3 U.S.

8.3.1 U.S. 2.5D and 3D IC Packaging Market Size, 2019-2030

8.3.2 By Company, U.S. 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.3.3 By Type, U.S. 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.3.4 By Application, U.S. 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.4 Europe

8.4.1 Europe 2.5D and 3D IC Packaging Market Size, 2019-2030

8.4.2 By Company, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.4.3 By Type, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.4.4 By Application, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.5 China

8.5.1 China 2.5D and 3D IC Packaging Market Size, 2019-2030

8.5.2 By Company, China 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.5.3 By Type, China 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.5.4 By Application, China 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.6 Japan

8.6.1 Japan 2.5D and 3D IC Packaging Market Size, 2019-2030

8.6.2 By Company, Japan 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.6.3 By Type, Japan 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.6.4 By Application, Japan 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.7 South Korea

8.7.1 South Korea 2.5D and 3D IC Packaging Market Size, 2019-2030

8.7.2 By Company, South Korea 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.7.3 By Type, South Korea 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.7.4 By Application, South Korea 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.8 Southeast Asia

8.8.1 Southeast Asia 2.5D and 3D IC Packaging Market Size, 2019-2030

8.8.2 By Company, Southeast Asia 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.8.3 By Type, Southeast Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.8.4 By Application, Southeast Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.9 India

8.9.1 India 2.5D and 3D IC Packaging Market Size, 2019-2030

8.9.2 By Company, India 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.9.3 By Type, India 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.9.4 By Application, India 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.10 Middle East & Asia

8.10.1 Middle East & Asia 2.5D and 3D IC Packaging Market Size, 2019-2030

8.10.2 By Company, Middle East & Asia 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.10.3 By Type, Middle East & Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.10.4 By Application, Middle East & Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

9 Global Manufacturers Profile

9.1 ASE Technology

9.1.1 ASE Technology Company Information, Head Office, Market Area and Industry Position

9.1.2 ASE Technology Company Profile and Main Business

9.1.3 ASE Technology 2.5D and 3D IC Packaging Models, Specifications and Application

9.1.4 ASE Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.1.5 ASE Technology Recent Developments

9.2 Samsung Electronics

9.2.1 Samsung Electronics Company Information, Head Office, Market Area and Industry Position

9.2.2 Samsung Electronics Company Profile and Main Business

9.2.3 Samsung Electronics 2.5D and 3D IC Packaging Models, Specifications and Application

9.2.4 Samsung Electronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.2.5 Samsung Electronics Recent Developments

9.3 Toshiba

9.3.1 Toshiba Company Information, Head Office, Market Area and Industry Position

9.3.2 Toshiba Company Profile and Main Business

9.3.3 Toshiba 2.5D and 3D IC Packaging Models, Specifications and Application

9.3.4 Toshiba 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.3.5 Toshiba Recent Developments

9.4 STMicroelectronics

9.4.1 STMicroelectronics Company Information, Head Office, Market Area and Industry Position

9.4.2 STMicroelectronics Company Profile and Main Business

9.4.3 STMicroelectronics 2.5D and 3D IC Packaging Models, Specifications and Application

9.4.4 STMicroelectronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.4.5 STMicroelectronics Recent Developments

9.5 Xilinx

9.5.1 Xilinx Company Information, Head Office, Market Area and Industry Position

9.5.2 Xilinx Company Profile and Main Business

9.5.3 Xilinx 2.5D and 3D IC Packaging Models, Specifications and Application

9.5.4 Xilinx 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.5.5 Xilinx Recent Developments

9.6 Intel

9.6.1 Intel Company Information, Head Office, Market Area and Industry Position

9.6.2 Intel Company Profile and Main Business

9.6.3 Intel 2.5D and 3D IC Packaging Models, Specifications and Application

9.6.4 Intel 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.6.5 Intel Recent Developments

9.7 Micron Technology

9.7.1 Micron Technology Company Information, Head Office, Market Area and Industry Position

9.7.2 Micron Technology Company Profile and Main Business

9.7.3 Micron Technology 2.5D and 3D IC Packaging Models, Specifications and Application

9.7.4 Micron Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.7.5 Micron Technology Recent Developments

9.8 TSMC

9.8.1 TSMC Company Information, Head Office, Market Area and Industry Position

9.8.2 TSMC Company Profile and Main Business

9.8.3 TSMC 2.5D and 3D IC Packaging Models, Specifications and Application

9.8.4 TSMC 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.8.5 TSMC Recent Developments

9.9 SK Hynix

9.9.1 SK Hynix Company Information, Head Office, Market Area and Industry Position

9.9.2 SK Hynix Company Profile and Main Business

9.9.3 SK Hynix 2.5D and 3D IC Packaging Models, Specifications and Application

9.9.4 SK Hynix 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.9.5 SK Hynix Recent Developments

9.10 Amkor Technology

9.10.1 Amkor Technology Company Information, Head Office, Market Area and Industry Position

9.10.2 Amkor Technology Company Profile and Main Business

9.10.3 Amkor Technology 2.5D and 3D IC Packaging Models, Specifications and Application

9.10.4 Amkor Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.10.5 Amkor Technology Recent Developments

9.11 GlobalFoundries

9.11.1 GlobalFoundries Company Information, Head Office, Market Area and Industry Position

9.11.2 GlobalFoundries Company Profile and Main Business

9.11.3 GlobalFoundries 2.5D and 3D IC Packaging Models, Specifications and Application

9.11.4 GlobalFoundries 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.11.5 GlobalFoundries Recent Developments

9.12 SanDisk (Western Digital)

9.12.1 SanDisk (Western Digital) Company Information, Head Office, Market Area and Industry Position

9.12.2 SanDisk (Western Digital) Company Profile and Main Business

9.12.3 SanDisk (Western Digital) 2.5D and 3D IC Packaging Models, Specifications and Application

9.12.4 SanDisk (Western Digital) 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.12.5 SanDisk (Western Digital) Recent Developments

9.13 Synopsys

9.13.1 Synopsys Company Information, Head Office, Market Area and Industry Position

9.13.2 Synopsys Company Profile and Main Business

9.13.3 Synopsys 2.5D and 3D IC Packaging Models, Specifications and Application

9.13.4 Synopsys 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.13.5 Synopsys Recent Developments

9.14 Invensas

9.14.1 Invensas Company Information, Head Office, Market Area and Industry Position

9.14.2 Invensas Company Profile and Main Business

9.14.3 Invensas 2.5D and 3D IC Packaging Models, Specifications and Application

9.14.4 Invensas 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.14.5 Invensas Recent Developments

9.15 Siliconware Precision Industries

9.15.1 Siliconware Precision Industries Company Information, Head Office, Market Area and Industry Position

9.15.2 Siliconware Precision Industries Company Profile and Main Business

9.15.3 Siliconware Precision Industries 2.5D and 3D IC Packaging Models, Specifications and Application

9.15.4 Siliconware Precision Industries 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.15.5 Siliconware Precision Industries Recent Developments

9.16 Jiangsu Changjiang Electronics

9.16.1 Jiangsu Changjiang Electronics Company Information, Head Office, Market Area and Industry Position

9.16.2 Jiangsu Changjiang Electronics Company Profile and Main Business

9.16.3 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Models, Specifications and Application

9.16.4 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.16.5 Jiangsu Changjiang Electronics Recent Developments

9.17 Powertech Technology

9.17.1 Powertech Technology Company Information, Head Office, Market Area and Industry Position

9.17.2 Powertech Technology Company Profile and Main Business

9.17.3 Powertech Technology 2.5D and 3D IC Packaging Models, Specifications and Application

9.17.4 Powertech Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.17.5 Powertech Technology Recent Developments

10 Conclusion

11 Appendix

11.1 Research Methodology

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Market Estimation Model

11.4 Disclaimer

Table 1. 2.5D and 3D IC Packaging Market Size & CAGR: China VS Global, (US$ Million), 2019-2030

Table 2. 2.5D and 3D IC Packaging Market Restraints

Table 3. 2.5D and 3D IC Packaging Market Trends

Table 4. 2.5D and 3D IC Packaging Industry Policy

Table 5. Global 2.5D and 3D IC Packaging Revenue by Company (2019-2024) & (US$ million)

Table 6. Global 2.5D and 3D IC Packaging Revenue Market Share by Company (2019-2024)

Table 7. Global 2.5D and 3D IC Packaging Manufacturers Market Concentration Ratio (CR3 and HHI)

Table 8. Global 2.5D and 3D IC Packaging Mergers & Acquisitions, Expansion Plans

Table 9. Global 2.5D and 3D IC Packaging Manufacturers Product Type

Table 10. China 2.5D and 3D IC Packaging Revenue by Company (2019-2024) & (US$ million)

Table 11. China 2.5D and 3D IC Packaging Revenue Market Share by Company (2019-2024)

Table 12. Global Key Players of 2.5D and 3D IC Packaging Upstream (Raw Materials)

Table 13. Global 2.5D and 3D IC Packaging Typical Customers

Table 14. 2.5D and 3D IC Packaging Typical Distributors

Table 15. By Type, Global 2.5D and 3D IC Packaging Revenue & CAGR, 2019 VS 2024 VS 2030, US$ Million

Table 16. By Application, Global 2.5D and 3D IC Packaging Revenue & CAGR, 2019 VS 2024 VS 2030, US$ Million

Table 17. By Region, Global 2.5D and 3D IC Packaging Market Size, 2019 VS 2024 VS 2030, US$ Million

Table 18. By Region, Global 2.5D and 3D IC Packaging Revenue, 2019-2030, US$ Million

Table 19. By Country, Global 2.5D and 3D IC Packaging Revenue & CAGR，2019 VS 2024 VS 2030, US$ Million

Table 20. By Country, Global 2.5D and 3D IC Packaging Revenue, 2019-2030, US$ Million

Table 21. By Country, Global 2.5D and 3D IC Packaging Revenue Market Share, 2019-2030

Table 22. ASE Technology Company Information, Head Office, Market Area and Industry Position

Table 23. ASE Technology Company Profile and Main Business

Table 24. ASE Technology 2.5D and 3D IC Packaging Models, Specifications and Application

Table 25. ASE Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 26. ASE Technology Recent Developments

Table 27. Samsung Electronics Company Information, Head Office, Market Area and Industry Position

Table 28. Samsung Electronics Company Profile and Main Business

Table 29. Samsung Electronics 2.5D and 3D IC Packaging Models, Specifications and Application

Table 30. Samsung Electronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 31. Samsung Electronics Recent Developments

Table 32. Toshiba Company Information, Head Office, Market Area and Industry Position

Table 33. Toshiba Company Profile and Main Business

Table 34. Toshiba 2.5D and 3D IC Packaging Models, Specifications and Application

Table 35. Toshiba 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 36. Toshiba Recent Developments

Table 37. STMicroelectronics Company Information, Head Office, Market Area and Industry Position

Table 38. STMicroelectronics Company Profile and Main Business

Table 39. STMicroelectronics 2.5D and 3D IC Packaging Models, Specifications and Application

Table 40. STMicroelectronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 41. STMicroelectronics Recent Developments

Table 42. Xilinx Company Information, Head Office, Market Area and Industry Position

Table 43. Xilinx Company Profile and Main Business

Table 44. Xilinx 2.5D and 3D IC Packaging Models, Specifications and Application

Table 45. Xilinx 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 46. Xilinx Recent Developments

Table 47. Intel Company Information, Head Office, Market Area and Industry Position

Table 48. Intel Company Profile and Main Business

Table 49. Intel 2.5D and 3D IC Packaging Models, Specifications and Application

Table 50. Intel 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 51. Intel Recent Developments

Table 52. Micron Technology Company Information, Head Office, Market Area and Industry Position

Table 53. Micron Technology Company Profile and Main Business

Table 54. Micron Technology 2.5D and 3D IC Packaging Models, Specifications and Application

Table 55. Micron Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 56. Micron Technology Recent Developments

Table 57. TSMC Company Information, Head Office, Market Area and Industry Position

Table 58. TSMC Company Profile and Main Business

Table 59. TSMC 2.5D and 3D IC Packaging Models, Specifications and Application

Table 60. TSMC 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 61. TSMC Recent Developments

Table 62. SK Hynix Company Information, Head Office, Market Area and Industry Position

Table 63. SK Hynix Company Profile and Main Business

Table 64. SK Hynix 2.5D and 3D IC Packaging Models, Specifications and Application

Table 65. SK Hynix 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 66. SK Hynix Recent Developments

Table 67. Amkor Technology Company Information, Head Office, Market Area and Industry Position

Table 68. Amkor Technology Company Profile and Main Business

Table 69. Amkor Technology 2.5D and 3D IC Packaging Models, Specifications and Application

Table 70. Amkor Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 71. Amkor Technology Recent Developments

Table 72. GlobalFoundries Company Information, Head Office, Market Area and Industry Position

Table 73. GlobalFoundries Company Profile and Main Business

Table 74. GlobalFoundries 2.5D and 3D IC Packaging Models, Specifications and Application

Table 75. GlobalFoundries 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 76. GlobalFoundries Recent Developments

Table 77. SanDisk (Western Digital) Company Information, Head Office, Market Area and Industry Position

Table 78. SanDisk (Western Digital) Company Profile and Main Business

Table 79. SanDisk (Western Digital) 2.5D and 3D IC Packaging Models, Specifications and Application

Table 80. SanDisk (Western Digital) 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 81. SanDisk (Western Digital) Recent Developments

Table 82. Synopsys Company Information, Head Office, Market Area and Industry Position

Table 83. Synopsys Company Profile and Main Business

Table 84. Synopsys 2.5D and 3D IC Packaging Models, Specifications and Application

Table 85. Synopsys 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 86. Synopsys Recent Developments

Table 87. Invensas Company Information, Head Office, Market Area and Industry Position

Table 88. Invensas Company Profile and Main Business

Table 89. Invensas 2.5D and 3D IC Packaging Models, Specifications and Application

Table 90. Invensas 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 91. Invensas Recent Developments

Table 92. Siliconware Precision Industries Company Information, Head Office, Market Area and Industry Position

Table 93. Siliconware Precision Industries Company Profile and Main Business

Table 94. Siliconware Precision Industries 2.5D and 3D IC Packaging Models, Specifications and Application

Table 95. Siliconware Precision Industries 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 96. Siliconware Precision Industries Recent Developments

Table 97. Jiangsu Changjiang Electronics Company Information, Head Office, Market Area and Industry Position

Table 98. Jiangsu Changjiang Electronics Company Profile and Main Business

Table 99. Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Models, Specifications and Application

Table 100. Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 101. Jiangsu Changjiang Electronics Recent Developments

Table 102. Powertech Technology Company Information, Head Office, Market Area and Industry Position

Table 103. Powertech Technology Company Profile and Main Business

Table 104. Powertech Technology 2.5D and 3D IC Packaging Models, Specifications and Application

Table 105. Powertech Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 106. Powertech Technology Recent Developments

List of Figure

Figure 1. 2.5D and 3D IC Packaging Picture

Figure 2. Global 2.5D and 3D IC Packaging Industry Market Size and Forecast (US$ million) & (2019-2030)

Figure 3. China 2.5D and 3D IC Packaging Revenue and Forecast (US$ million) & (2019-2030)

Figure 4. 2019-2030 China 2.5D and 3D IC Packaging Market Share of Global

Figure 5. Global 2.5D and 3D IC Packaging Key Participants, Market Share, 2021 VS 2022 VS 2023

Figure 6. Global 2.5D and 3D IC Packaging Market Share by Company, (Tier 1, Tier 2 and Tier 3), 2019-2024

Figure 7. China 2.5D and 3D IC Packaging Key Participants, Market Share, 2021 VS 2022 VS 2023

Figure 8. China 2.5D and 3D IC Packaging Revenue, Domestic VS Import Products, Proportion of China Local Players and Foreign Players, 2019-2024

Figure 9. 2.5D and 3D IC Packaging Industry Chain

Figure 10. 2.5D

Figure 11. 3D TSV

Figure 12. 3D Wafer-level Chip-scale Packaging

Figure 13. By Type, Global 2.5D and 3D IC Packaging Revenue, 2019-2030, US$ Million

Figure 14. By Type, Global 2.5D and 3D IC Packaging Revenue Market Share, 2019-2030

Figure 15. Consumer Electronics

Figure 16. Medical Devices

Figure 17. Communications and Telecom

Figure 18. Automotive

Figure 19. Other

Figure 20. By Application, Global 2.5D and 3D IC Packaging Revenue, 2019-2030, US$ Million

Figure 21. By Application, Global 2.5D and 3D IC Packaging Revenue Market Share, 2019-2030

Figure 22. By Region, Global 2.5D and 3D IC Packaging Revenue Market Share, 2019-2030

Figure 23. North America 2.5D and 3D IC Packaging Revenue & Forecasts, 2019-2030, US$ Million

Figure 24. By Country, North America 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

Figure 25. Europe 2.5D and 3D IC Packaging Revenue & Forecasts, 2019-2030, US$ Million

Figure 26. By Country, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

Figure 27. Asia Pacific 2.5D and 3D IC Packaging Revenue & Forecasts, 2019-2030, US$ Million

Figure 28. By Country/Region, Asia Pacific 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

Figure 29. South America 2.5D and 3D IC Packaging Revenue & Forecasts, 2019-2030, US$ Million

Figure 30. By Country, South America 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

Figure 31. Middle East & Africa 2.5D and 3D IC Packaging Revenue & Forecasts, 2019-2030, US$ Million

Figure 32. U.S. 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 33. By Company, U.S. 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 34. By Type, U.S. 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 35. By Application, U.S. 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 36. Europe 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 37. By Company, Europe 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 38. By Type, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 39. By Application, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 40. China 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 41. By Company, China 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 42. By Type, China 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 43. By Application, China 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 44. Japan 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 45. By Company, Japan 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 46. By Type, Japan 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 47. By Application, Japan 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 48. South Korea 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 49. By Company, South Korea 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 50. By Type, South Korea 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 51. By Application, South Korea 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 52. Southeast Asia 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 53. By Company, Southeast Asia 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 54. By Type, Southeast Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 55. By Application, Southeast Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 56. India 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 57. By Company, India 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 58. By Type, India 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 59. By Application, India 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 60. Middle East & Asia 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 61. By Company, Middle East & Asia 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 62. By Type, Middle East & Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 63. By Application, Middle East & Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 64. Research Methodology

Figure 65. Breakdown of Primary Interviews

Figure 66. Bottom-up Approaches

Figure 67. Top-down Approaches

Methodology/Research Approach

This research study involved the extensive usage of both primary and secondary data sources. The research process involved the study of various factors affecting the industry, including the government policy, market environment, competitive landscape, historical data, present trends in the market, technological innovation, upcoming technologies and the technical progress in related industry, and market risks, opportunities, market barriers and challenges. The following illustrative figure shows the market research methodology applied in this report.

Research Programs/Design

Historical Data (2015-2019)	Industry Trends Competitive Landscape By Company Expansion Mergers and Acquisitions Market Segment by Type by Application By Regions/ Geography	Value Status and Outlook Value for Major Players Market Share Growth Rate Present Situation Analysis Value Market Share Growth Rate Present Situation Analysis
Influencing Factors	Market Environment Government Policy Technological Changes Market Risks	Market Drivers Growing Demand of Downstream Reduction in Cost
Market Forecast (2021-2026)	Overall Size by Type by Application By Regions/Geography	Key Data (Value) Market Share Growth Rate CAGR (2021-2026)

Market Size Estimation

Top-down and bottom-up approaches are used to validate the global Voluntary Carbon Offset market size market and estimate the market size for Company, regions segments, product segments and Application (end users).

The market estimations in this report are based on the marketed sale price of Voluntary Carbon Offset (excluding any discounts provided by the player, distributor, wholesaler or traders). The percentage splits, market share, and breakdowns of the product segments are derived on the basis of weights assigned to each of the segments on the basis of their utilization rate and average sale price. The regional splits of the overall Voluntary Carbon Offset market and its sub-segments are based on the percentage adoption or utilization of the given product in the respective region or country.

Major Company in the market is identified through secondary research and their market revenues determined through primary and secondary research. Secondary research included the research of the annual and financial reports of the top Company; whereas, primary research included extensive interviews of key opinion leaders and industry experts such as experienced front-line staff, directors, CEOs and marketing executives. The percentage splits, market share, Growth Rate and breakdowns of the product markets are determined through using secondary sources and verified through the primary sources.

All possible factors that influence the markets included in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data. The market size for top-level markets and sub-segments is normalized, and the effect of inflation, economic downturns, and regulatory & policy changes or other factors are not accounted for in the market forecast. This data is combined and added with detailed inputs and analysis from Market Intellix and presented in this report

The following figure shows an illustrative representation of the overall market size estimation process used for this study.

Market Breakdown and Data Triangulation

After complete market engineering with calculations for market statistics; market size estimations; market forecasting; market breakdown; and data triangulation, extensive primary research was conducted to gather information and verify and validate the critical numbers arrived at. In the complete market engineering process, both top-down and bottom-up approaches were extensively used, along with several data triangulation methods, to perform market estimation and market forecasting for the overall market segments and sub-segments listed in this report. Extensive qualitative and further quantitative analysis is also done from all the numbers arrived at in the complete market engineering process to list key information throughout the report.

Data Source

Secondary Sources

Secondary sources include such as press releases, annual reports, non-profit organizations, industry associations, governmental agencies and customs data, etc. This research study involves the usage of widespread secondary sources, directories, databases such as Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), and TRADING ECONOMICS, and News Network, statista, Federal Reserve Economic Data, annual reports, BIS Statistics, ICIS; company house documents; CAS(American Chemical Society); investor presentations; and SEC filings of companies. Secondary research was used to identify and collect information useful for the extensive, technical, market-oriented, and Hospitals study of the Voluntary Carbon Offset market. It was also used to obtain important information about the top companies, market classification and segmentation according to industry trends to the bottom-most level, and key developments related to market and technology perspectives.

Market Size	Segmental value Geographic Penetration Product Adoption Rate for Different market	Journals, Websites, and Press Releases Annual Reports and SEC Filings Company Websites and Press Releases Public and Paid Databases Market Intellix Data Repository
Market Position of Top Company	Product Financials Geographic value Mix Total Company value Business/Segmental value Mix
Qualitative Analysis	Influence Factors Market Potential Market Risks and Opportunities Industry Trends Geographical Features Government Policies	Company Websites and Press Releases Public and Paid Databases Annual Reports Industry Associations Market Intellix Data Repository

Primary Sources

In the primary research process, various sources from both the supply and demand sides were interviewed to obtain qualitative and quantitative information for this report. The primary sources from the supply side include product Company (and their competitors), opinion leaders, industry experts, research institutions, distributors, dealer and traders, as well as the raw materials suppliers and producers, etc.

The primary sources from the demand side include industry experts such as business leaders, marketing and sales directors, technology and innovation directors, supply chain executive, end use (product buyers), and related key executives from various key companies and organizations operating in the global market.

Primary research was conducted to identify segmentation Type, product price range, product Application, key Company, raw materials supply and the downstream demand, industry status and outlook, and key market dynamics such as risks, influence factors, opportunities, market barriers, industry trends, and key player strategies.

Key Executives Interviewed

Key Data Information from Primary Sources

Primary Sources	Parameters	Key Data
Market Segments(by Application, by Type)	Value by Type Status and Forecast Value by Application Value by Regions, Status and Forecast (2021-2026)	Value Market Share by Type Value Growth Rate by Type Value by Application Percentage and Growth Rate by Application Value Growth Rate and Market Share by Regions Market Size Status and Forecast (2021-2026)
Total Market	Overall Size, Status and Forecast	Market Size Status and Forecast (2021-2026)