Fully Automatic Semiconductor Molding Equipment Market 2022: Industry Size, Emerging Trends, Growth Insights, Opportunities, and Forecast By 2028
This report aims to provide a comprehensive presentation of the global market for Fully Automatic Semiconductor Molding Equipment study by Market Intellix gives insights concerning the market elements influencing the market, Market scope, Market division, and overlays shadow upon the leading market players featuring the positive cutthroat scene and patterns beating the years.
Global Fully Automatic Semiconductor Molding Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Fully Automatic Semiconductor Molding Equipment Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Fully Automatic Semiconductor Molding Equipment companies in 2021 (%)
The global Fully Automatic Semiconductor Molding Equipment market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Hydraulic Semiconductor Molding System Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Fully Automatic Semiconductor Molding Equipment include TOWA, ASMPT, Besi, I-PEX, Yamada, TAKARA TOOL & DIE, Asahi Engineering, Tongling Fushi Sanjia and Nextool Technology and etc. In 2021, the global top five players have a share approximately % in terms of revenue.
The study provides the Fully Automatic Semiconductor Molding Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Segmental Outline:
Global Fully Automatic Semiconductor Molding Equipment Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Fully Automatic Semiconductor Molding Equipment Market Segment Percentages, by Type, 2021 (%)
Hydraulic Semiconductor Molding System
Electric Semiconductor Molding System
Global Fully Automatic Semiconductor Molding Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Fully Automatic Semiconductor Molding Equipment Market Segment Percentages, by Application, 2021 (%)
Wafer Level Packaging
BGA Packaging
Flat Panel Packaging
Others
Global Fully Automatic Semiconductor Molding Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Fully Automatic Semiconductor Molding Equipment Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Fully Automatic Semiconductor Molding Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Fully Automatic Semiconductor Molding Equipment revenues share in global market, 2021 (%)
Key companies Fully Automatic Semiconductor Molding Equipment sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Fully Automatic Semiconductor Molding Equipment sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
TOWA
ASMPT
Besi
I-PEX
Yamada
TAKARA TOOL & DIE
Asahi Engineering
Tongling Fushi Sanjia
Nextool Technology
DAHUA Technology
This Report Addresses:
– Market Intelligence enables effective decision-making
– Market estimates and forecasts from 2022 to 2028
– Growth opportunities and trend analysis
– Segment and regional revenue forecast for market evaluation
– Competitive strategy and analysis of market segments
– List of product innovations to stay on top.
– The impact of COVID-19 and how to survive in these fast-growing markets.
1 Introduction to Research & Analysis Reports
1.1 Fully Automatic Semiconductor Molding Equipment Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Fully Automatic Semiconductor Molding Equipment Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Fully Automatic Semiconductor Molding Equipment Overall Market Size
2.1 Global Fully Automatic Semiconductor Molding Equipment Market Size: 2021 VS 2028
2.2 Global Fully Automatic Semiconductor Molding Equipment Revenue, Prospects & Forecasts: 2017-2028
2.3 Global Fully Automatic Semiconductor Molding Equipment Sales: 2017-2028
3 Company Landscape
3.1 Top Fully Automatic Semiconductor Molding Equipment Players in Global Market
3.2 Top Global Fully Automatic Semiconductor Molding Equipment Companies Ranked by Revenue
3.3 Global Fully Automatic Semiconductor Molding Equipment Revenue by Companies
3.4 Global Fully Automatic Semiconductor Molding Equipment Sales by Companies
3.5 Global Fully Automatic Semiconductor Molding Equipment Price by Manufacturer (2017-2022)
3.6 Top 3 and Top 5 Fully Automatic Semiconductor Molding Equipment Companies in Global Market, by Revenue in 2021
3.7 Global Manufacturers Fully Automatic Semiconductor Molding Equipment Product Type
3.8 Tier 1, Tier 2 and Tier 3 Fully Automatic Semiconductor Molding Equipment Players in Global Market
3.8.1 List of Global Tier 1 Fully Automatic Semiconductor Molding Equipment Companies
3.8.2 List of Global Tier 2 and Tier 3 Fully Automatic Semiconductor Molding Equipment Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type - Global Fully Automatic Semiconductor Molding Equipment Market Size Markets, 2021 & 2028
4.1.2 Hydraulic Semiconductor Molding System
4.1.3 Electric Semiconductor Molding System
4.2 By Type - Global Fully Automatic Semiconductor Molding Equipment Revenue & Forecasts
4.2.1 By Type - Global Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2022
4.2.2 By Type - Global Fully Automatic Semiconductor Molding Equipment Revenue, 2023-2028
4.2.3 By Type - Global Fully Automatic Semiconductor Molding Equipment Revenue Market Share, 2017-2028
4.3 By Type - Global Fully Automatic Semiconductor Molding Equipment Sales & Forecasts
4.3.1 By Type - Global Fully Automatic Semiconductor Molding Equipment Sales, 2017-2022
4.3.2 By Type - Global Fully Automatic Semiconductor Molding Equipment Sales, 2023-2028
4.3.3 By Type - Global Fully Automatic Semiconductor Molding Equipment Sales Market Share, 2017-2028
4.4 By Type - Global Fully Automatic Semiconductor Molding Equipment Price (Manufacturers Selling Prices), 2017-2028
5 Sights By Application
5.1 Overview
5.1.1 By Application - Global Fully Automatic Semiconductor Molding Equipment Market Size, 2021 & 2028
5.1.2 Wafer Level Packaging
5.1.3 BGA Packaging
5.1.4 Flat Panel Packaging
5.1.5 Others
5.2 By Application - Global Fully Automatic Semiconductor Molding Equipment Revenue & Forecasts
5.2.1 By Application - Global Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2022
5.2.2 By Application - Global Fully Automatic Semiconductor Molding Equipment Revenue, 2023-2028
5.2.3 By Application - Global Fully Automatic Semiconductor Molding Equipment Revenue Market Share, 2017-2028
5.3 By Application - Global Fully Automatic Semiconductor Molding Equipment Sales & Forecasts
5.3.1 By Application - Global Fully Automatic Semiconductor Molding Equipment Sales, 2017-2022
5.3.2 By Application - Global Fully Automatic Semiconductor Molding Equipment Sales, 2023-2028
5.3.3 By Application - Global Fully Automatic Semiconductor Molding Equipment Sales Market Share, 2017-2028
5.4 By Application - Global Fully Automatic Semiconductor Molding Equipment Price (Manufacturers Selling Prices), 2017-2028
6 Sights by Region
6.1 By Region - Global Fully Automatic Semiconductor Molding Equipment Market Size, 2021 & 2028
6.2 By Region - Global Fully Automatic Semiconductor Molding Equipment Revenue & Forecasts
6.2.1 By Region - Global Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2022
6.2.2 By Region - Global Fully Automatic Semiconductor Molding Equipment Revenue, 2023-2028
6.2.3 By Region - Global Fully Automatic Semiconductor Molding Equipment Revenue Market Share, 2017-2028
6.3 By Region - Global Fully Automatic Semiconductor Molding Equipment Sales & Forecasts
6.3.1 By Region - Global Fully Automatic Semiconductor Molding Equipment Sales, 2017-2022
6.3.2 By Region - Global Fully Automatic Semiconductor Molding Equipment Sales, 2023-2028
6.3.3 By Region - Global Fully Automatic Semiconductor Molding Equipment Sales Market Share, 2017-2028
6.4 North America
6.4.1 By Country - North America Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2028
6.4.2 By Country - North America Fully Automatic Semiconductor Molding Equipment Sales, 2017-2028
6.4.3 US Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.4.4 Canada Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.4.5 Mexico Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.5 Europe
6.5.1 By Country - Europe Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2028
6.5.2 By Country - Europe Fully Automatic Semiconductor Molding Equipment Sales, 2017-2028
6.5.3 Germany Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.5.4 France Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.5.5 U.K. Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.5.6 Italy Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.5.7 Russia Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.5.8 Nordic Countries Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.5.9 Benelux Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.6 Asia
6.6.1 By Region - Asia Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2028
6.6.2 By Region - Asia Fully Automatic Semiconductor Molding Equipment Sales, 2017-2028
6.6.3 China Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.6.4 Japan Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.6.5 South Korea Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.6.6 Southeast Asia Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.6.7 India Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.7 South America
6.7.1 By Country - South America Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2028
6.7.2 By Country - South America Fully Automatic Semiconductor Molding Equipment Sales, 2017-2028
6.7.3 Brazil Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.7.4 Argentina Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.8 Middle East & Africa
6.8.1 By Country - Middle East & Africa Fully Automatic Semiconductor Molding Equipment Revenue, 2017-2028
6.8.2 By Country - Middle East & Africa Fully Automatic Semiconductor Molding Equipment Sales, 2017-2028
6.8.3 Turkey Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.8.4 Israel Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.8.5 Saudi Arabia Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
6.8.6 UAE Fully Automatic Semiconductor Molding Equipment Market Size, 2017-2028
7 Manufacturers & Brands Profiles
7.1 TOWA
7.1.1 TOWA Corporate Summary
7.1.2 TOWA Business Overview
7.1.3 TOWA Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.1.4 TOWA Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.1.5 TOWA Key News
7.2 ASMPT
7.2.1 ASMPT Corporate Summary
7.2.2 ASMPT Business Overview
7.2.3 ASMPT Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.2.4 ASMPT Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.2.5 ASMPT Key News
7.3 Besi
7.3.1 Besi Corporate Summary
7.3.2 Besi Business Overview
7.3.3 Besi Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.3.4 Besi Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.3.5 Besi Key News
7.4 I-PEX
7.4.1 I-PEX Corporate Summary
7.4.2 I-PEX Business Overview
7.4.3 I-PEX Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.4.4 I-PEX Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.4.5 I-PEX Key News
7.5 Yamada
7.5.1 Yamada Corporate Summary
7.5.2 Yamada Business Overview
7.5.3 Yamada Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.5.4 Yamada Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.5.5 Yamada Key News
7.6 TAKARA TOOL & DIE
7.6.1 TAKARA TOOL & DIE Corporate Summary
7.6.2 TAKARA TOOL & DIE Business Overview
7.6.3 TAKARA TOOL & DIE Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.6.4 TAKARA TOOL & DIE Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.6.5 TAKARA TOOL & DIE Key News
7.7 Asahi Engineering
7.7.1 Asahi Engineering Corporate Summary
7.7.2 Asahi Engineering Business Overview
7.7.3 Asahi Engineering Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.7.4 Asahi Engineering Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.7.5 Asahi Engineering Key News
7.8 Tongling Fushi Sanjia
7.8.1 Tongling Fushi Sanjia Corporate Summary
7.8.2 Tongling Fushi Sanjia Business Overview
7.8.3 Tongling Fushi Sanjia Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.8.4 Tongling Fushi Sanjia Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.8.5 Tongling Fushi Sanjia Key News
7.9 Nextool Technology
7.9.1 Nextool Technology Corporate Summary
7.9.2 Nextool Technology Business Overview
7.9.3 Nextool Technology Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.9.4 Nextool Technology Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.9.5 Nextool Technology Key News
7.10 DAHUA Technology
7.10.1 DAHUA Technology Corporate Summary
7.10.2 DAHUA Technology Business Overview
7.10.3 DAHUA Technology Fully Automatic Semiconductor Molding Equipment Major Product Offerings
7.10.4 DAHUA Technology Fully Automatic Semiconductor Molding Equipment Sales and Revenue in Global (2017-2022)
7.10.5 DAHUA Technology Key News
8 Global Fully Automatic Semiconductor Molding Equipment Production Capacity, Analysis
8.1 Global Fully Automatic Semiconductor Molding Equipment Production Capacity, 2017-2028
8.2 Fully Automatic Semiconductor Molding Equipment Production Capacity of Key Manufacturers in Global Market
8.3 Global Fully Automatic Semiconductor Molding Equipment Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Fully Automatic Semiconductor Molding Equipment Supply Chain Analysis
10.1 Fully Automatic Semiconductor Molding Equipment Industry Value Chain
10.2 Fully Automatic Semiconductor Molding Equipment Upstream Market
10.3 Fully Automatic Semiconductor Molding Equipment Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Fully Automatic Semiconductor Molding Equipment Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer
Methodology/Research Approach
This research study involved the extensive usage of both primary and secondary data sources. The research process involved the study of various factors affecting the industry, including the government policy, market environment, competitive landscape, historical data, present trends in the market, technological innovation, upcoming technologies and the technical progress in related industry, and market risks, opportunities, market barriers and challenges. The following illustrative figure shows the market research methodology applied in this report.Research Programs/Design
| Historical Data (2015-2019) |
|
|
| Influencing Factors |
|
|
| Market Forecast (2021-2026) |
|
|
Market Size Estimation
Top-down and bottom-up approaches are used to validate the global Voluntary Carbon Offset market size market and estimate the market size for Company, regions segments, product segments and Application (end users).
The market estimations in this report are based on the marketed sale price of Voluntary Carbon Offset (excluding any discounts provided by the player, distributor, wholesaler or traders). The percentage splits, market share, and breakdowns of the product segments are derived on the basis of weights assigned to each of the segments on the basis of their utilization rate and average sale price. The regional splits of the overall Voluntary Carbon Offset market and its sub-segments are based on the percentage adoption or utilization of the given product in the respective region or country.
Major Company in the market is identified through secondary research and their market revenues determined through primary and secondary research. Secondary research included the research of the annual and financial reports of the top Company; whereas, primary research included extensive interviews of key opinion leaders and industry experts such as experienced front-line staff, directors, CEOs and marketing executives. The percentage splits, market share, Growth Rate and breakdowns of the product markets are determined through using secondary sources and verified through the primary sources.
All possible factors that influence the markets included in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data. The market size for top-level markets and sub-segments is normalized, and the effect of inflation, economic downturns, and regulatory & policy changes or other factors are not accounted for in the market forecast. This data is combined and added with detailed inputs and analysis from Market Intellix and presented in this report
The following figure shows an illustrative representation of the overall market size estimation process used for this study.
Market Breakdown and Data Triangulation
After complete market engineering with calculations for market statistics; market size estimations; market forecasting; market breakdown; and data triangulation, extensive primary research was conducted to gather information and verify and validate the critical numbers arrived at. In the complete market engineering process, both top-down and bottom-up approaches were extensively used, along with several data triangulation methods, to perform market estimation and market forecasting for the overall market segments and sub-segments listed in this report. Extensive qualitative and further quantitative analysis is also done from all the numbers arrived at in the complete market engineering process to list key information throughout the report.
Data Source
Secondary Sources
Secondary sources include such as press releases, annual reports, non-profit organizations, industry associations, governmental agencies and customs data, etc. This research study involves the usage of widespread secondary sources, directories, databases such as Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), and TRADING ECONOMICS, and News Network, statista, Federal Reserve Economic Data, annual reports, BIS Statistics, ICIS; company house documents; CAS(American Chemical Society); investor presentations; and SEC filings of companies. Secondary research was used to identify and collect information useful for the extensive, technical, market-oriented, and Hospitals study of the Voluntary Carbon Offset market. It was also used to obtain important information about the top companies, market classification and segmentation according to industry trends to the bottom-most level, and key developments related to market and technology perspectives.
| Market Size |
|
|
| Market Position of Top Company |
|
|
| Qualitative Analysis |
|
|
Primary Sources
In the primary research process, various sources from both the supply and demand sides were interviewed to obtain qualitative and quantitative information for this report. The primary sources from the supply side include product Company (and their competitors), opinion leaders, industry experts, research institutions, distributors, dealer and traders, as well as the raw materials suppliers and producers, etc.
The primary sources from the demand side include industry experts such as business leaders, marketing and sales directors, technology and innovation directors, supply chain executive, end use (product buyers), and related key executives from various key companies and organizations operating in the global market.
Primary research was conducted to identify segmentation Type, product price range, product Application, key Company, raw materials supply and the downstream demand, industry status and outlook, and key market dynamics such as risks, influence factors, opportunities, market barriers, industry trends, and key player strategies.
Key Executives Interviewed
Key Data Information from Primary Sources
| Primary Sources | Parameters | Key Data |
| Market Segments(by Application, by Type) |
|
|
| Total Market |
|
|